FR4 1.5mm 0/35um + laminated photoresist

8,00 

Category:

Description

Single sided, base material for producing printed circuit boards laminated by negative dry film photoresist.

Glass-reinforced epoxy laminate dielectricum.

Dielectricum layer is yellow transparent.

Dielectricum thickness: 1.55mm

Sheet measurements  312×218 mm

Copper foil thickness: 0/35 μm.

 

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