FR4 1.5mm 18/18um + laminated photoresist

(23 customer reviews)

12,00 

Category:

Description

Double sided, base material for producing printed circuit boards laminated by negative dry film photoresist.

Glass-reinforced epoxy laminate dielectricum.

Dielectricum layer is yellow transparent.

Dielectricum thickness: 1.55mm

Sheet measurements  312×218 mm

Copper foil thickness: 18/18 μm.

 

23 reviews for FR4 1.5mm 18/18um + laminated photoresist

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