FR4 1.5mm 0/35um + laminated photoresist

Single sided, base material for producing printed circuit boards laminated by negative dry film photoresist.

Glass-reinforced epoxy laminate dielectricum.

Dielectricum layer is yellow transparent.

Dielectricum thickness: 1.55mm

Sheet measurements  312×218 mm

Copper foil thickness: 0/35 μm.